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Ju Young Kim
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Proceedings Papers
ISTFA2017, ISTFA 2017: Conference Proceedings from the 43rd International Symposium for Testing and Failure Analysis, 40-42, November 5–9, 2017,
Abstract
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NCF (Non Conductivity Film) is a material used for under-fill purpose in the TSV (Through Silicon Via) process, and is a key material for ensuring TSV 3D Package (PKG) reliability. Among the types of defects generated by the NCF, the most typical type is delamination. Particularly in NCF delamination frequently occurs during reliability test, we analyzed chemical state change of NCF according to reliability test step/condition by utilizing FTIR and TMA. Through these studies, we clarify the cause of Delamination.
