While 2.5D and 3D solutions continue to drive advancements in the electronics packaging industry, challenges persist with their reliability and qualification. In this paper, we introduce a new technique that may prove valuable for nondestructive, in-situ measurements of package and die warpage. This system allows for the powerful visualization tools of Computed Tomography to be applied to samples at elevated and cryogenic temperatures over a broad temperature range (+125C to -257C).

This paper describes a project to develop and deploy a systematic screening methodology involving computed tomography (CT) to inspect a set of electromagnetic interference (EMI) filter components for a spacecraft application. The goal was to deploy the nondestructive CT test to replace the destructive test method typically deployed for such components. The paper describes the development of test criteria, fixturing, inspection process, and data analysis, including quantitative image analysis of voids and cracks. The initial results indicated that the parts would not pass the requirements established in the test design. A waiver was written to the project clarifying that if the parts were to be used in the assembly, they should be considered as simple conductors with EMI filtering capability viewed as an added benefit rather than a guaranteed design requirement.