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Jesus Rocha
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Proceedings Papers
ISTFA2008, ISTFA 2008: Conference Proceedings from the 34th International Symposium for Testing and Failure Analysis, 476-480, November 2–6, 2008,
Abstract
PDF
Abstract Packaging-based short circuits are inherently difficult to analyze due to the unprotected nature of the shorting material in the package. A combination of SQUID, low-power x-ray and OBIRCH techniques were used in conjunction with parallel grinding to identify the location of the short and reveal it for subsequent characterization. This procedure can reliably identify metal-based shorts in most plastic packaging material.
