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François Kerisit
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Proceedings Papers
ISTFA2014, ISTFA 2014: Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, 87-93, November 9–13, 2014,
Abstract
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Abstract The introduction of silver as bonding material led to new failure analysis issues. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-based alloy wires. It is shown that dry chemistry allows better control and selectivity on the EMC/ Cu and Ag-based bond wires.
