This presentation covers ion beam analytical tools, their capabilities, and uses. It provides an overview of ion sources, examines emerging trends in surface analysis, and assesses the potential of ultrafast lasers for panoscopic patterning, athermal ablation, and elemental analysis. It compares and contrasts liquid metal, gas field, and plasma sources and presents examples highlighting the capabilities of FIB-SIMS and FIB-SEM Auger/XPS surface analysis techniques. It also introduces computationally guided microspectroscopy (CGM) and assesses its potential impact on multi-variant analysis, point spread deconvolution, and compressed sensing.

This presentation covers ion beam analytical tools, their capabilities, and uses. It provides an overview of ion sources, examines emerging trends in surface analysis, and assesses the potential of ultrafast lasers for panoscopic patterning, athermal ablation, and elemental analysis. It compares and contrasts liquid metal, gas field, and plasma sources and presents examples highlighting the capabilities of FIB-SIMS and FIB-SEM Auger/XPS surface analysis techniques. It also introduces computationally guided microspectroscopy (CGM) and assesses its potential impact on multi-variant analysis, point spread deconvolution, and compressed sensing.

Increased insight into the internal structure of microelectronic devices can be achieved through the use of three dimensional (3D) imaging based on image stacks of serial sections obtained with a combined electron and ion beam (CrossBeam) FIB. This study describes how such data can be collected and presented, some of the factors that need to be optimized to get the best images, and the limitations of the method. It can be viewed as a first step in the emerging area of high resolution 3D microscopy, a technique that can lead to more accurate characterization of the shapes of internal structures and their interconnectivity at the nanoscale.