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Dave Mark
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Proceedings Papers
ISTFA2004, ISTFA 2004: Conference Proceedings from the 30th International Symposium for Testing and Failure Analysis, 409-413, November 14–18, 2004,
Abstract
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Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.