Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Article Type
Volume Subject Area
Date
Availability
1-1 of 1
Daniel P. Hartgerink
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Proceedings Papers
ISTFA2010, ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis, 369-372, November 14–18, 2010,
Abstract
PDF
Abstract Counterfeit parts are marketed with the intent to deceive the customer. This intent to deceive defines a counterfeit part and separates it from faulty parts, which have defects that are unknown to the manufacturer or distributor. This paper presents three cases in which counterfeit electronic parts were assembled into hardware items and later found to be faulty in some manner. Laboratory techniques used to identify these parts as counterfeits are presented. Non-laboratory techniques that could have prevented the parts from entering service in these cases are also described. Techniques to combat counterfeit parts range from very simple observation of the parts and the paperwork to failure analysis carried out in a laboratory environment. In all of these cases, the potential existed to detect the counterfeit parts prior to assembly into hardware and prior to field deployment of the defective devices.