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Daechul Choi
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Proceedings Papers

In-Situ Thermal Chamber 3D X-Ray Computed Tomography for Non-Destructive Detection of Submicron Via-Crack in Printed Circuit Boards

Daechul Choi, Sooyoung Ji, Jaelim Choi, Miyang Kim, Eunju Yang ...
ISTFA2020, ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis, 314-316, November 15–19, 2020,
https://doi.org/10.31399/asm.cp.istfa2020p0314
Abstract
In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good agreement was made. This fault isolation method is proposed as a possible solution for identifying submicron cracks in PCB substrates during challenging investigations.
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Proceedings Papers

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

Daechul Choi, Yoonseong Kim, Jongyun Kim, Han Kim
ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 43-46, October 28–November 1, 2018,
https://doi.org/10.31399/asm.cp.istfa2018p0043
Abstract
In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.
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