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Celine Ribiere
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Proceedings Papers
ISTFA2013, ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis, 7-11, November 3–7, 2013,
Abstract
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Abstract We have exploited an innovative X-ray tomography system, which is hosted in a Scanning Electron Microscope (SEM). The resolution reached by this equipment is closed to 160nm in 2 dimensions. We imaged Through Silicon Vias (TSV) which have undergone a manufacturing defect and characterized voids within these interconnections.
