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Cecile Bonifacio
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Proceedings Papers
ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 410-413, October 31–November 4, 2021,
Abstract
PDF
This paper presents a development in semiconductor device delayering by broad ion beam milling that offers a uniform delayering area on a millimeter scale. A milling area of this size is made possible by the user's ability to position ion beams individually to cover the desired area. This flexibility in ion beam positioning also enables more precise targeting of an area of interest.
