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C.M. Ng
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Proceedings Papers
ISTFA2007, ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis, 156-160, November 4–8, 2007,
Abstract
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Abstract In this paper, the application of pulsed-TIVA for the localization of Cu/low- k interconnect reliability defects in comb test structures is described. Two types of subtle dielectric defects which are otherwise not detectable with conventional TIVA can be detected with pulsed-TIVA.
