Abstract In this work, we introduce the use of the x-ray image as the unique fingerprint for an electronic component or printed circuit board assembly (PCBA). Unique features of the x-ray image include solder voids, cracks, part alignment, die attach porosity and voiding, die placement and alignment, and wire bonding diagram. These are just a few of the many features in the x-ray image that can be used in tandem to create a unique fingerprint for a single component or an entire PCBA. This technique can also be expanded to mechanical objects by utilizing other idiosyncratic features of the part - such as voids and porosity - to generate the x-ray image fingerprint.

Abstract The drive towards miniaturization has created increasing challenges to the overall failure analysis and quality inspection of electronic devices. This trend has equally challenged the image quality of x-ray inspection systems – engineers need to see more details in each inspection. Image quality is paramount to the ability of making actionable decisions on the information acquired from an x-ray machine. Previous generations of x-ray technologies have focused on hardware improvements – better x-ray sources and better x-ray sensors. Although further improvements can still be achieved in hardware, our focus will be on the latest wave of technology breakthroughs and innovation in radiography systems: algorithms.