Abstract The need for reverse engineering (for IP verification or for reproducibility) has reached unprecedented levels requiring not only the inspection of the circuitry but also the understanding of the packaging and interconnects. Achieving the best X-ray inspection for a particular application depends on an in-depth understanding of the X-ray system configuration, the sample configuration, and the sample preparation techniques available. This paper presents various case examples on the development of advanced X-ray inspection techniques for IC reverse engineering, along with information on the limitations of X-ray imaging, issues with 3D reconstruction, models for resolution configuration improvement, and advantages and disadvantages of advanced sample preparation techniques. It is observed that the novel X-ray inspection techniques, combined with appropriate sample prep techniques, provide the necessary resolution to achieve results necessary for current reverse engineering needs.

Abstract It is known by both the commercial and government suppliers, one of the best ways to guarantee the security and reliability of IC's is to image the IC directly using an x-ray microscope. These images can be inspected for many signs of counterfeit electronics. Unfortunately, previous generations of x-ray imaging systems have not kept up with the increasingly sophisticated counterfeiting techniques. Traditional 2D X-ray inspection techniques are becoming inadequate for imaging and verifying features due to the limited resolution of these systems for thick samples and because 2D images contain too many overlapping features to easily discern, making identification very difficult. This paper discusses the development of advanced sample preparation techniques for counterfeit IC detection. It presents information on the limitations of X-ray imaging and 3D tomographic reconstruction, and on the models for resolution configuration improvement.