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Anand Shankar
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Proceedings Papers
Heterogeneous Industry Collaboration and System CAD Navigation for Advanced Package Failure Analysis
ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 108-114, October 31–November 4, 2021,
Abstract
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The emergence of heterogenous integration driven by system-in-package (SiP) technology not only increases the complexity of semiconductor failure analysis, but also makes it more difficult to protect intellectual property because of the growing need to share design information to facilitate fault isolation in assembly and test. One way to address these challenges is through a computer-aided design (CAD) database that can be navigated across multiple components without exposing sensitive information. This paper describes the development and use of such a resource and how it enables safe and secure data sharing among supply chain partners.