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Alvina Jean Tampos
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Proceedings Papers
ISTFA2021, ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis, 362-365, October 31–November 4, 2021,
Abstract
PDF
An image sensor module failed in the field and was returned showing functional issues and a supply-to-ground short. After the hard lens mounted over the imaging chip was removed, the short disappeared along with the functional issues. This paper explains how the authors were able to restore the failure mode and discover the underlying defect, via backside focused ion beam cross-sectioning, with minimal intrusion into the top-side package and silicon.