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Alex Kirichhenko
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Proceedings Papers
ISTFA2018, ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis, 148-152, October 28–November 1, 2018,
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As research in superconducting electronics matures, it is necessary to have failure analysis techniques to identify parameters that impact yield and failure modes in the fabricated product. However, there has been significant skepticism regarding the ability of laser-based failure analysis techniques to detect defects at room temperature in superconducting electronics designed to operate at cryogenic temperatures. In this paper, we describe preliminary data showing the use of Thermally Induced Voltage Alteration (TIVA) [1] at ambient temperature to locate defects in known defective circuits fabricated using state-of-the-art techniques for superconducting electronics.