Flip Chip and Backside Techniques (2024 Update)

Cole, Edward I.; Fishgrab, Kira L.; Barton, Daniel L.; Bernhard-Höfer, Karoline

doi:10.31399/asm.cp.istfa2024tpr1

ISTFA 2024

October 28–November 1, 2024

San Diego, California, USA

Conference Sponsors:

ISTFA 2024: Tutorial Presentations from the 50th International Symposium for Testing and Failure Analysis

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Flip Chip and Backside Techniques (2024 Update)

Edward I. Cole;

Edward I. Cole

Sandia National Laboratories

,

Albuquerque, NM, USA

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Kira L. Fishgrab;

Kira L. Fishgrab

Sandia National Laboratories

,

Albuquerque, NM, USA

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Daniel L. Barton;

Daniel L. Barton

Sandia National Laboratories

,

Albuquerque, NM, USA

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Karoline Bernhard-Höfer

Infineon

,

Regensburg, Germany

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Paper No: istfa2024tpr1, pp. r1-r60; 60 pages

https://doi.org/10.31399/asm.cp.istfa2024tpr1

Published Online: October 28 2024

Abstract

Presentation slides for the ISTFA 2024 Tutorial session “Flip Chip and Backside Techniques (2024 Update).”

backside techniques, flip chip

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2024

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Flip Chip and Backside Techniques (2024 Update)

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