TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices

Bonifacio, Cecile S.

doi:10.31399/asm.cp.istfa2024tpn1

ISTFA 2024

October 28–November 1, 2024

San Diego, California, USA

Conference Sponsors:

ISTFA 2024: Tutorial Presentations from the 50th International Symposium for Testing and Failure Analysis

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TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices

Cecile S. Bonifacio

E.A. Fischione Instruments Inc.

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Paper No: istfa2024tpn1, pp. n1-n68; 68 pages

https://doi.org/10.31399/asm.cp.istfa2024tpn1

Published Online: October 28 2024

Abstract

Presentation slides for the ISTFA 2024 Tutorial session “TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices.”

failure analysis, sample preparation, semiconductor devices, transmission electron microscopy

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2024

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TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices

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TEM Sample Preparation for Electron Microscopy Characterization and Failure Analysis of Advanced Semiconductor Devices