Abstract
Laser probing (LP) has traditionally been used with high-bandwidth oscilloscopes to gather transistor toggling data, providing picosecond-level temporal accuracy. However, this method requires longer acquisition time, making it less favored compared to other fault isolation (FI) techniques. This paper presents an innovative approach to LP using a high-speed digitizer, which significantly reduces the overall LP cycle time. Practical use cases and recommendations for implementing this method are also discussed, highlighting the benefits of using high-speed digitizers in LP for fault isolation.
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2024
ASM International
Issue Section:
Die Level Fault Isolation
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