Abstract
Cross-sectional analysis plays a crucial role in failure analysis for the identification of root causes associated with implants or junction profiles. Traditionally, this step involves junction staining. Recently, Electron Beam Induced Current (EBIC) analysis has emerged as a valuable alternative, offering the key advantage of visualizing various implantations and junction profiles through non-chemical means. This paper presents an innovative sample preparation technique for cross-sectional EBIC analysis, incorporating an additional step of FIB (Focused Ion Beam) grooving at the target site before cross-sectional polishing. Unlike conventional methods that involve laborious and time-consuming fine cross-sectional polishing, our approach enhances precision and efficiency. With the elimination of the need for extensive polishing, direct access to the target is achieved after rough polishing, thereby expediting the analytical process.
