Failure Analysis Challenges for Chip Scale Packages (2023 Update)

ISTFA 2023

November 12–16, 2023

Phoenix, Arizona, USA

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PROCEEDINGS PAPER

Susan X. Li

Infineon Technologies

,

San Jose, California, USA

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Paper No: istfa2023tpz1, pp. z1-z95; 95 pages

https://doi.org/10.31399/asm.cp.istfa2023tpz1

Published Online: November 12 2023

Abstract

Presentation slides for the ISTFA 2023 Tutorial session “Failure Analysis Challenges for Chip Scale Packages (2023 Update).”

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2023

ASM International

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