Non-Destructive Defect Localization by Scanning Acoustic Microscopy

ISTFA 2023

November 12–16, 2023

Phoenix, Arizona, USA

Conference Sponsors:

PROCEEDINGS PAPER

Sebastian Brand;

Sebastian Brand

Fraunhofer Institute for Microstructure of Materials and Systems IMWS

,

Halle, Germany

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Michael Kögel

Fraunhofer Institute for Microstructure of Materials and Systems IMWS

,

Halle, Germany

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Paper No: istfa2023tpy1, pp. y1-y31; 31 pages

https://doi.org/10.31399/asm.cp.istfa2023tpy1

Published Online: November 12 2023

Abstract

Presentation slides for the ISTFA 2023 Tutorial session “Non-Destructive Defect Localization by Scanning Acoustic Microscopy.”

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2023

ASM International

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