An Introduction to the FIB as a Microchip Circuit Edit Tool (2023 Update)

Herschbein, Steven; Tan, Shida; Livengood, Richard; Wong, Michael

doi:10.31399/asm.cp.istfa2023tpb2

ISTFA 2023

November 12–16, 2023

Phoenix, Arizona, USA

Conference Sponsors:

ISTFA 2023: Tutorial Presentations from the 49th International Symposium for Testing and Failure Analysis

PROCEEDINGS PAPER

An Introduction to the FIB as a Microchip Circuit Edit Tool (2023 Update)

Steven Herschbein;

Steven Herschbein

Independent Consultant

,

Hopewell Junction, New York, USA

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Shida Tan;

Shida Tan

Intel Corporation

,

Santa Clara, California, USA

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Richard Livengood;

Richard Livengood

Intel Corporation

,

Santa Clara, California, USA

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Michael Wong

Thermo Fisher Scientific

,

Hillsboro, Oregon, USA

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Paper No: istfa2023tpb2, pp. b1-b70; 70 pages

https://doi.org/10.31399/asm.cp.istfa2023tpb2

Published Online: November 12 2023

Abstract

Presentation slides for the ISTFA 2023 Tutorial session “An Introduction to the FIB as a Microchip Circuit Edit Tool (2023 Update).”

focused ion beam, microchip circuit editing

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2023

ASM International

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An Introduction to the FIB as a Microchip Circuit Edit Tool (2023 Update)

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