For decades, device scaling has been the primary driver of the performance boost in integrated circuit (IC) devices. However, this trend has slowed down in recent years due to physical limitations and technical challenges. To continue meeting the ever-increasing demand for high-performance computing, other innovations such as advanced transistor designs and packaging schemes have emerged. Advanced transistors, such as FinFETs and Gate-all-around FET (GAAFETs), have been developed to overcome the limitations of traditional planar transistors, offering higher performance and energy efficiency. Meanwhile, advanced packaging schemes, such as system-in-package (SiP), 2.5D, and 3D packaging, offer higher integration densities, improved thermal management, and faster data transmission. These innovations are crucial in driving the development of high-performance computing, and they will play an essential role in meeting the growing demand for faster and more efficient computing.

This content is only available as a PDF.
You do not currently have access to this content.