This presentation provides a systematic approach for assessing contamination risks in semiconductor manufacturing environments and determining an appropriate course of action. It maps out a typical wafer production line and identifies potential entry points for specific contaminants. It explains how to perform a contamination risk assessment and prioritize action items and how to select an analytical technique based on where, in the stack, the contaminant resides. It highlights the differences between direct and indirect techniques and shows where they are likely to be used. It also presents a detailed analytical decision flow chart and three concise case studies.