This presentation covers the challenges associated with IC package inspection and shows how two nondestructive techniques, scanning acoustic microscopy and X-ray imaging, are being used to locate and identify a wide range of defects, particularly those in 3D packages and multilayer boards. It reviews the basic principles of scanning acoustic microscopy (SAM), X-ray imaging, and 3D X-ray tomography and the factors that affect image resolution and depth. It demonstrates the current capabilities of each method along with different approaches for improving resolution, contrast, and measurement time.

3D packages, 3D X-ray tomography, nondestructive imaging, scanning acoustic microscopy, spatial resolution, X-ray radiography
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2022
ASM International
Topics
Electronic packaging Scanning acoustic microscopy Semiconductor wafer fabrication X-ray radiography Resolution Test method evaluation
Issue Section:
Package and Physical Analysis Challenges
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