Viewing the cross section of wafers with glass carriers has always been a challenging task. Add on to observing and determining the glue coverage is an uphill struggle due to the fragile nature of the glue. The traditional technique of cleaving wafers equipped with glass carriers is neither promising nor highly successful. In addition to the mentioned disadvantages, the presence of glass carrier would mean cleaving the wafer with a diamond scriber, a dangerous technique due to the possibility of fragmentation of the glass carrier which could be a potential safety hazard. Time consuming, low success rate, lack of finesse and potential safety hazard of the conventional cleaving method had paved the path of an alternative technique to assess glue coverage for wafers equipped with glass carriers. This manuscript would give an elaborate insight of a novel technique employed in analysing the glue coverage of wafers with glass carriers.

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