A Novel Fault Analysis Approach for a High Resistance via with Nano-Probing on FIB Recess Sample and TEM Lamella

Siti Nurjatikesuma, Che Nan; Huey Wen, Loo; Pey Fen, Oung; Chong Haw, Lee

doi:10.31399/asm.cp.istfa2022p0343

ISTFA 2022

October 30–November 3, 2022

Pasadena, California, USA

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ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis

PROCEEDINGS PAPER

A Novel Fault Analysis Approach for a High Resistance via with Nano-Probing on FIB Recess Sample and TEM Lamella

Che Nan Siti Nurjatikesuma;

Che Nan Siti Nurjatikesuma

Intel Microelectronic

,

Bayan Lepas, Penang, Malaysia

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Loo Huey Wen;

Loo Huey Wen

Intel Microelectronic

,

Bayan Lepas, Penang, Malaysia

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Oung Pey Fen;

Oung Pey Fen

Intel Microelectronic

,

Bayan Lepas, Penang, Malaysia

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Lee Chong Haw

Intel Microelectronic

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Bayan Lepas, Penang, Malaysia

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Paper No: istfa2022p0343, pp. 343-346; 4 pages

https://doi.org/10.31399/asm.cp.istfa2022p0343

Published Online: October 30 2022

Abstract

This paper has been withdrawn at the request of the author.

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A Novel Fault Analysis Approach for a High Resistance via with Nano-Probing on FIB Recess Sample and TEM Lamella

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