Abstract
Complex failure analysis often requires the use of multiple characterization instruments. For example, a defect or failure may be localized using one tool, whereas the subsequent marking, precision targeting, and high-resolution analysis may require completely different instruments. As a result, the analysis workflows require sample and operator coordination between instruments and engineers, which leads to lower throughput and success rates. This paper describes a complete in-situ workflow for comprehensive failure analysis processes on a compound semiconductor using a state-of-the-art FIB/SEM system, incorporating electron channeling contrast imaging (ECCI) and a STEM-in-SEM detector used in unison with an insertable detector positioned underneath the sample to capture transmitted electron condensed beam electron diffraction (CBED) micrographs.
