This presentation introduces the practice of focused ion beam (FIB) chip editing and its power and versatility as a problem-solving tool. It begins with a review of the features and functions of FIB systems, the role of gas chemistry in milling, etching, and deposition, and the use of IR imaging for navigation and targeting. It goes on to identify challenges due to packaging materials, chip-package interactions, and other factors, and in each case, provide alternate approaches and procedures to circumvent potential problems. It also covers advanced practices and methods and assesses potential future advancements.

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