This presentation covers the basic physics needed to effectively apply backside IC analysis techniques to flip-chip packaged die. It describes the principles of light transmission through silicon and the factors that influence optical image formation from the backside of the wafer or die. It also provides information on the tools and techniques used to expose surfaces, regions, and features of interest for analysis. It describes the steps involved in CNC milling, mechanical grinding and polishing, reactive ion etching (RIE), laser microchemical (LMC) etching, and milling and etching by focused ion beam (FIB). It explains where and how each technique is used and quantifies the capabilities of different combinations of methods.
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Issue Section:Fault Isolation