An image sensor module failed in the field and was returned showing functional issues and a supply-to-ground short. After the hard lens mounted over the imaging chip was removed, the short disappeared along with the functional issues. This paper explains how the authors were able to restore the failure mode and discover the underlying defect, via backside focused ion beam cross-sectioning, with minimal intrusion into the top-side package and silicon.

backside fault isolation, electronic modules, focused ion beam cross-sectioning, precision milling, Seebeck effect imaging, supply-to-ground short
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2021
ASM International
Topics
Electronic packaging Specimen preparation Milling Focused ion beam tomography Semiconductor wafer fabrication Thermography
Issue Section:
Poster Session
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