An image sensor module failed in the field and was returned showing functional issues and a supply-to-ground short. After the hard lens mounted over the imaging chip was removed, the short disappeared along with the functional issues. This paper explains how the authors were able to restore the failure mode and discover the underlying defect, via backside focused ion beam cross-sectioning, with minimal intrusion into the top-side package and silicon.

This content is only available as a PDF.
You do not currently have access to this content.