This paper presents a large-volume workflow for fast failure analysis of microelectronic devices. The workflow incorporates a stand-alone ps-laser ablation tool and a FIB-SEM system. As implemented, the picosecond laser is used to quickly remove large volumes of bulk material while the Xe plasma FIB provides precise end-pointing to the feature of interest and fine surface polishing after laser ablation. The paper presents several application examples, including a full workflow to prepare artefact-free, delamination-free cross-sections in an AMOLED mobile display and the preparation of devices and packages (including flip chips) of varying size. It also covers related issues such as CAD navigation, data correlation, and the use of bitmap overlays for end-pointing.

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