A protocol for obtaining an advanced TEM lamella geometry using FIB-SEM is presented. Lamella lift-out procedure might require multiple manipulation steps or even breaking the vacuum in order to reach inverted or plan-view lamella geometries. We have developed a setup which enables lamella transfer from a bulk sample onto a TEM grid within a single, very simple manipulation step, with no need to break the vacuum or unload the sample. Most importantly, this approach does not require any additional devices to be installed.

focused ion beam, lamella geometries, scanning electron microscopy, transmission electron microscopy
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2020
ASM International
Topics
Scanning electron microscopy Transmission electron microscopy Semiconductor wafer fabrication
Issue Section:
FIB Circuit Analysis and Edit
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