Soft Defect Localization (SDL) method has been a common failure analysis technique used in fault isolation of temperature dependent failures, however proper signal conditioning and conversion of the monitored signal into a pass/fail signal are critical in acquiring an accurate defect location. This paper presents case studies where LabVIEW software using NI-PXI test platform was successfully implemented to effectively convert the failure mode into a pass/fail signal which provided a reliable SDL result.

failure analysis, fault isolation, NI-PXI test, soft defect localization
This content is only available as a PDF.
Copyright © 2020 ASM International. All rights reserved.
2020
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Fault Isolation
You do not currently have access to this content.