We demonstrate how electro optical terahertz pulse reflectometry (EOTPR) can be used in conjunction with a new one-dimensional lump circuit simulation software to quickly and non-destructively isolate faults in advanced IC packages. In the case studies presented, short failures are accurately located in a series of advanced IC package.

electro optical terahertz pulse reflectometry, integrated circuit packages, non-destructively isolate faults, one-dimensional lump circuit
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Copyright © 2019 ASM International. All rights reserved.
2019
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
3D Devices and Packages
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