Abstract

Failure analysis on mixed-signal ICs for automotive applications often requires the use of EVBs (evaluation boards) to replicate the failure mode. Typically, automotive ICs are used in conjunction with other components to create automotive modules, such as; PCM (power-train control modules), ECU (engine control units), TCU (transmission control units), etc. EVBs are used to replicate module level functionality, as well as reproduce ATE (automatic test equipment) tests required for analysis. An integral part of EVB design, functionality and performance is related to the IC socket, which is the direct interface between the IC and the EVB. See Figure 1. EVB socket solutions will vary based on the required analysis (backside / topside analysis), package type and IC functionality.

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