Abstract
As advanced silicon-on-insulator (SOI) technology becomes a more widespread technology offering, failure analysis approaches should be adapted to new device structures. We review two nanoprobing case studies of advanced SOI technology, detailing the electrical characterization of a compound gate-to-drain defect as well as the characterization of unexpected SOI source-to-well leakage.
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Copyright © 2019 ASM International. All rights reserved.
2019
ASM International
Issue Section:
Nanoprobing and Electrical Characterization
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