Abstract
Reverse engineering of today’s integrated circuits requires proper sample preparation, high speed imaging and data processing capabilities. The electron-optical design and the data handling architecture of our multi-beam scanning electron microscopes are scalable over a large range of beam numbers, providing sufficient imaging speed - also for the foreseeable future. A first step in data processing for reverse engineering on images acquired with a multi-beam scanning electron microscope has been successfully shown in preliminary tests.
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2019
ASM International
Issue Section:
Microscopy
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