Low energy (i.e., 5 keV, 3 keV) Xe+ plasma FIB methods were applied to Si ex situ lift out specimens. Cs-corrected STEM imaging reveals the Si dumbbell structure indicating excellent surface quality achieved during the low energy polishing steps.

ex situ lift out, scanning transmission electron microscopy, silicon dumbbell structure, surface quality, Xenon plasma focused ion beam
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2019
ASM International
Topics
Specimen preparation Scanning transmission electron microscopy Focused ion beam tomography Semiconductor wafer fabrication
Issue Section:
Focused Ion Beam Sample Preparation
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