Protection layers on double ex situ lift-out TEM specimens were investigate in this paper and two protection layer approaches for double INLO or double EXLO were introduced. The improved protection methods greatly decreased the damage layer on the top surface from 90 nm to 5 nm (or lower) during FIB milling. According to the property of different sample and its preliminary treatment in the FIB, we have the satisfactory approaches to be applied. Using this improved protection method, we demonstrate the structures within the TEM lamella can be observed without ion beam damage/implantation during FIB

ex situ lift-out, failure analysis, focused ion beam, in-situ lift-out, lamella preparation, transmission electron microscopy
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Copyright © 2019 ASM International. All rights reserved.
2019
ASM International
Topics
Specimen preparation Transmission electron microscopy Focused ion beam tomography Semiconductor wafer fabrication
Issue Section:
Focused Ion Beam Sample Preparation
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