The advent of bare die form in the semiconductor industry driven by the high-performance multichip modules’ (MCM) requirement posed electrical access and testing challenges on customer returned units (CRUs) for failure analysis (FA). In this technical literature, the developed die extraction processes and re-packaging solution on molded MCM and flex package types were discussed.

bare dies, customer returned units, die extraction, failure analysis, flex packaging, molding, multichip modules, semiconductor industry
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Copyright © 2019 ASM International. All rights reserved.
2019
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Failure Analysis Process
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