This research sets up failure analysis flow to verify failure mechanisms and root causes of different kinds of contact leakage. This flow mainly uses EBIC, C-AFM and nano-probing to do fault isolation and confirm electrical failure mechanisms. Appropriate sample preparation is also mandatory for FIB, SEM and TEM inspection.

conductive atomic force microscopy, electrical failure mechanisms, electron-beam-induced current, faulti isolation, focused ion beam, nanoprobing, sample preparation, scanning electron microscopes, transmission electron microscopy
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Copyright © 2019 ASM International. All rights reserved.
2019
ASM International
Topics
Specimen preparation Scanning electron microscopy Transmission electron microscopy Atomic force microscopy Semiconductor wafer fabrication
Issue Section:
Failure Analysis Process
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