In this paper, an automated contactless defect analysis technique using Computer Vision (CV) algorithms is presented. The proposed method includes closed-loop control of optical tools for automated image collection, as well as advanced image analysis methods to improve image quality and detect potential defects. As an example, the technique was successfully used to identify delamination defects along the perimeter of a large test chip.

advanced image analysis, automated contactless defect analysis, automated image collection, computer vision algorithms, delamination defects, image quality
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Copyright © 2018 ASM International. All rights reserved.
2018
ASM International
Topics
Semiconductor wafer fabrication Test method evaluation
Issue Section:
Advanced Methods and Techniques
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