Abstract

In this work, we introduce the use of the x-ray image as the unique fingerprint for an electronic component or printed circuit board assembly (PCBA). Unique features of the x-ray image include solder voids, cracks, part alignment, die attach porosity and voiding, die placement and alignment, and wire bonding diagram. These are just a few of the many features in the x-ray image that can be used in tandem to create a unique fingerprint for a single component or an entire PCBA. This technique can also be expanded to mechanical objects by utilizing other idiosyncratic features of the part - such as voids and porosity - to generate the x-ray image fingerprint.

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