Failure Analysis of Micro Defective Structure on a pnp Power Device Available to Purchase

In this paper we introduce a physical analysis approach using focus ion beam (FIB) and scanning electron microscopy (SEM) to investigate a micro defective structure at active contact trench which caused a voltage breakdown of power device. In this case study, a lower probe current through FIB milling and a lower accelerating voltage in SEM imaging have been applied to identify the micro structure defect.