There are several methods commonly used to locate the area of interest (AOI), such as using layout landmarks, applying laser marks, focus ion beam marks, etc. This paper discusses another method which can improve the job efficiency and cost-effectiveness by introducing the combination of laser marking and laser deprocessing technique (LDT) as a quick way to deprocess the AOI. It further explores LDT to improve the job efficiency and throughput in logic devices to achieve cost-saving targets. An experiment was performed on a 14nm technology node prototype chip that integrated logic and SRAM. The proposed LDT has demonstrated itself to be a useful method to increase the job efficiency by performing in batch and easy to locate the AOI upon loading the sample for SEM inspection. It is also a simple and cost-effective way to delayer comparing to other methodologies.