Abstract

The given project is to benchmark typical preparation methods under the aspect of the influence of initial intrinsic stresses inside electric components. Raman spectroscopy has been applied as well as the piezo resistive readout on a specifically designed model stress monitoring chip.

electric components, failure analysis, flip chips, intrinsic stress, piezoresistive readout, Raman spectroscopy, stress monitoring
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Copyright © 2017 ASM International. All rights reserved.
2017
ASM International
Topics
Specimen preparation Semiconductor wafer fabrication Raman spectroscopy
Issue Section:
Packaging and Assembly Analysis
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