This paper presents unique case studies describing the use of EBAC technique. Front as well as backside EBAC on relatively smaller nets is presented to isolate logic fails which are otherwise hard to capture using conventional failure analysis techniques.

electron beam absorbed current, failure analysis, fault isolation, semiconductor devices
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Copyright © 2017 ASM International. All rights reserved.
2017
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Nanoprobing
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